Exypnos presents its patented Component Bonding Technology, an innovative method to connect components to substrates.
This technology prepositions and seals the component on the substrate in a manner, that when the reacting polyurethane mixture is poured through dedicated openings in the component, a shape is obtained that anchors the component.
Component Bonding Technology eliminates surface treatments and results in limitless material selection towards adhesion. Pressure-less pouring facilitates precise positioning of components, while short curing times are obtained by the fast reacting polyurethane glue.